Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport
US7948764B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2005 |
| Grant date | May 24, 2011 |
| Priority date | — |
| Expiry date | May 22, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2804
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component (40) having connection pads, whereof one predetermined pad (41A) is provided with a bump (42); providing a support having (30) to the predetermined pad via the bump; aligning the predetermined pad provided with the bump with the terminal; contacting the bump and the terminal and assembling them in specific temperature and pressure conditions. Prior to contacting and fixing the bump and the terminal, the surface of the terminal is covered with an insulating layer (32), the insulating layer being a material selected so as to be traversed by the bump in the temperature and pressure conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.