Electrical component
US7952197B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2009 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Jul 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09972
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention discloses an electrical component with a carrier substrate, on which at least one semiconductor chip is mounted. Terminal areas are arranged on the underside of the carrier substrate and contact areas designed for the assembly with semiconductor chips are arranged on the upper side. The carrier substrate has a functional area that is divided into sections, wherein each section is assigned at least one function such as, e.g., as a filter, a frequency-separating filter, a balun, etc. A separate area of the carrier substrate is assigned to each section. The following applies to at least one of the sections: the contact area and/or the terminal area that is conductively connected to the section lies outside the base of this section. The connecting line that conductively connects the input or output of the respective section to the contact area and/or the terminal area is preferably shielded from the section by a ground area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.