Method and apparatus for de-embedding on-wafer devices
US7954080B2 · kind B2 · utility
10Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2008 |
| Grant date | May 31, 2011 |
| Priority date | — |
| Expiry date | Sep 29, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/34
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and system for de-embedding an on-wafer device is disclosed. The method comprises representing the intrinsic characteristics of a test structure using a set of ABCD matrix components; determining the intrinsic characteristics arising from the test structure; and using the determined intrinsic characteristics of the test structure to produce a set of parameters representative of the intrinsic characteristics of a device-under-test (“DUT”).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.