Connector assembly having electronic components mounted thereto
US7955093B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2009 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Dec 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10325
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A connector assembly configured to be mounted to a device substrate is provided. She connector assembly includes a connector substrate, an electronic component. contacts, and conductive wires. The connector substrate has a mounting side and an opposite supporting side interconnected by an edge. The mounting side is used to mount the connector substrate to the device substrate. The electronic component is disposed on the supporting side of the connector substrate. The contacts are provided on the mounting side of the connector substrate and are used to electrically couple the electronic component with the device substrate. The wires are joined to the electronic component and to the contacts. The wires extend along the supporting and mounting sides and wrap around the edge of the connector substrate. The conductive wires are separated from one another by a separation gap along the supporting side and the mounting side of the connector substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.