Glass mold polishing method and structure
US7955160B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2008 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Jul 11, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/11
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A glass mold polishing structure and method. The method includes providing a polishing tool comprising mounting plate, a chuck plate over and mechanically attached to the mounting plate, and a pad structure over and mechanically attached to the chuck plate. A retaining structure is attached the chuck plate. A glass mold comprising a plurality of cavities is placed on the pad structure and within a perimeter formed by the retaining structure. A vacuum device is attached to the chuck plate. The vacuum device is activated such that a vacuum is formed and mechanically attaches the glass mold to the pad structure. The polishing tool comprising the glass mold mechanically attached to the pad structure is placed over and in contact with the polishing pad. The polishing tool comprising the glass mold is rotated. The glass mold is polished as a result of the rotation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.