Composition and method for planarizing surfaces
US7955519B2 · kind B2 · utility
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16References
24Claims
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Key dates
| Filing date | Sep 30, 2005 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Jul 9, 2027 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/02
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides compositions and methods for planarizing or polishing a surface. One composition comprises about 0.01 wt. % to about 20 wt. % α-alumina particles, wherein the α-alumina particles have an average diameter of 200 nm or less, and 80% of the α-alumina particles have a diameter of about 500 nm or less, an organic acid, a corrosion inhibitor, and water. Another composition comprises α-alumina particles, an organic acid, dual corrosion inhibitors of triazole and benzotriazole, wherein the wt. % ratio of the triazole to benzotriazole is about 0.1 to about 4.8, and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.