Method of overmolding a substrate
US7955543B2 · kind B2 · utility
17Cited by
27References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2004 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Feb 17, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of overmolding a substrate having a first side and a second side and a product made by that process. A plurality of support feet are placed on the first side of the substrate. The substrate is placed in an injection mold. The mold is filled with a molding material with the molding material enveloping both the first side and the second side of the substrate. The substrate is removed having been overmolded from the injection mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.