Ink composition and metallic material
US7956103B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2007 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Jul 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24355
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
To provide an ink composition capable of forming a metallic material which is excellent in adhesion to a substrate and free from ion migration. An ink composition having fine metallic copper particles and/or fine copper hydride particles, and fine silver oxide particles or fine metallic silver particles, dispersed in a water-insoluble organic liquid, which composition has a solid content concentration of from 10 to 80 mass % and contains from 5 to 90 parts by mass of the fine metallic copper particles and/or fine copper hydride particles, and from 10 to 95 parts by mass of the fine silver oxide particles or fine metallic silver particles, per 100 parts by mass of the total solid content in the ink composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.