Hermetically packaged MEMS G-switch
US7956302B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2008 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Sep 1, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0828
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A hermetically packaged G-switch includes a MEMS structure having a bottom substrate layer, a top device layer and an intermediate oxide layer. A mass disposed in the top device layer is connected to one, two or three anchor portions using spring arms. One end of a spring arm is connected to the mass and another end to an anchor portion. The connection to the anchor portion includes a T shaped arrangement, which has a torsional spring cross piece connected to the spring arm. A cap containing a conductive pad is hermetically sealed to the MEMS structure. When a predetermined acceleration is attained, the mass makes electrical contact with the conductive pad to close the G-switch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.