Light emitting diode structure having a textured package lens

US7956375B2 · kind B2 · utility

Assignee

• Au Optronics Corporation · TW

Inventors

• Yueh-Han Li · Guanshan, TW
• Po-Tang Hsu · Taipei, TW
• Chien-Ming Ko · Taipei, TW
• Hung-Ching Lee · Baoshan, TW
• Chih-Wei Lin · Hsinchu, TW

Key dates

• Filing date: Jun 16, 2009
• Grant date: Jun 7, 2011
• Expiry date: Jun 16, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/855

Abstract

A light emitting diode structure and a light emitting diode structure forming method are provided. The light emitting diode structure includes a base, a diode chip, and a package lens. The diode chip is mounted on the base. The package lens covers the diode chip. The surface of the package lens includes a plurality of dot structures. The steps of the method include mounting a light-emitting diode chip on a base, assembling a package lens to cover the light emitting diodes chip, and forming a plurality of dot structures on the surface of the package lens.