Electrical connection of a substrate within a vacuum device via electrically conductive epoxy/paste
US7956521B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 10, 2008 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Jun 28, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An image intensifier includes a microchannel plate (MCP) having an output surface, and a ceramic substrate having an outer surface. The output surface of the MCP and the outer surface of the ceramic substrate are oriented facing each other. An imager is substantially buried within the ceramic substrate, and an input surface of the imager is exposed to receive electrons from the output surface of the MCP. The input surface of the imager and the outer surface of the ceramic substrate are oriented in substantially the same plane. The input surface of the imager and the outer surface of the ceramic substrate are disposed at a very close distance from the output surface of the MCP. The imager includes input/output pads, and the ceramic substrate includes input/output pads. A conductive epoxy connects a respective input/output pad of the imager to a respective input/output pad of the ceramic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.