Heating resistor element component, thermal printer, and manufacturing method for a heating resistor element component
US7956880B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 16, 2009 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | May 29, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49083
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A heating resistor element component has supporting substrate with a concave portion formed in a surface of the supporting substrate. A glass substrate is disposed on the surface of the supporting substrate. At least a region of the glass substrate opposite to the concave portion of the support substrate has a heterogeneous phase structure with physical properties different from those of the material of the glass substrate such that an overall mechanical strength of the glass substrate is increased. The heterogeneous phase structure is formed by laser processing using a phemtosecond laser having a power intensity of 1×106 W to 1×108 W. Heating resistors are arranged at intervals on the glass substrate and have heating portions disposed opposite to the concave portion of the supporting substrate. A common wire is connected to one end of each of the heating resistors. Individual wires are each connected to another end of each of the heating resistors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.