Circuit device
US7957158B2 · kind B2 · utility
11Cited by
3References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Oct 30, 2007 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Jun 7, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit device having improved packaging density is provided. A circuit device of the present invention includes: a circuit board having its surface covered with an insulating layer; conductive patterns formed on a surface of the insulating layer; circuit elements electrically connected to the conductive patterns; and leads connected to pads formed of the conductive patterns. Furthermore, a control element is fixed to an upper surface of a land part formed of a part of a lead, and a back surface of the land part is spaced apart from an upper surface of the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.