Deformable thermal pads for optical fibers
US7957623B2 · kind B2 · utility
6Cited by
8References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2008 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Apr 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A system for fiber optic packaging includes a first substrate and a first deformable pad coupled to the first substrate. The first deformable pad is characterized by a thermal conductivity greater than 1 W/mK. The system also includes a fiber coil having at least a portion embedded in the first deformable pad to provide physical contact between the at least a portion of the fiber coil and the first deformable pad. The system further includes a second substrate coupled to the fiber coil and at least a portion of the first deformable pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.