Method for positioning and/or guiding at least one arbitrary process head for the metalization of thin substrates at a defined distance above the substrate surface

US7957829B2 · kind B2 · utility

Assignee

• JONAS & REDMANN AUTOMATIONSTECHNIK GMBH · DE

Inventors

• Stefan Jonas · Berlin, DE
• Lutz Redmann · Kleinmachnow, DE
• Michael Merscher · Falkensee, DE
• Claudio Uriarte · Bremen, DE

Key dates

• Filing date: Dec 17, 2008
• Grant date: Jun 7, 2011
• Expiry date: Jul 26, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/1241
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A method for positioning or guiding at least one arbitrary print head or a printing unit having at least one pressure nozzle for the imprinting of thin substrates such as wafers at a defined distance above the surface of the substrate, which is to be provided on a support like a paddle or printing table. Distance sensors continuously acquired distance measurements to the surface of the substrate which is to be imprinted. An adjustment of the print head up to 6 degrees of freedom is ensured by actuators in such a manner that the section of the opening of the pressure nozzle of the print head can be adjusted so as to be coplanar to the section of the surface of the substrate which is to be imprinted. The print head is thus maintained or readjusted so as to adjust the section of the opening of the pressure nozzle of the print head to the surface of the substrate which is to be positioned on the support table so as to be coplanar and so as to maintain the coplanar position during the printing process.