Observing an internal link via a second link
US7958283B2 · kind B2 · utility
12Cited by
13References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 13, 2008 |
| Grant date | Jun 7, 2011 |
| Priority date | — |
| Expiry date | Aug 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In one embodiment, the present invention includes a method for selecting first data received in a first die of a multi-chip package (MCP) from a second die of the MCP via an intra-package link for output from a selector during a first clock period of a first clock signal, selecting second data transmitted from the second die to the first die for output from the selector during a second clock period, and transmitting the first and second data from the MCP via an external link. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.