Method of attaching an electronic device to an MLCC having a curved surface
US7958627B2 · kind B2 · utility
4Cited by
7References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2008 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Mar 12, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.