Electronic inlay module used for electronic cards and tags
US7959085B2 · kind B2 · utility
2Cited by
55References
44Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 9, 2007 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Jan 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1322
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed electronic inlay and the method of making such an electronic inlay includes a circuit board, a plurality of circuit components attached to the circuit board, a bottom cover sheet, a top cover sheet, and a layer of thermosetting material between the bottom and top cover sheets. The electronic inlay can be used to manufacture electronic cards while using conventional equipment to apply top and bottom overlays to the electronic inlay.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.