Particle removal cleaning method and composition
US7959739B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 8, 2008 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Dec 8, 2028 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning solution and method for removing submicron particles from the surface and/or the bevel of an electronic substrate such as a hard disk media substrate, or an imprint mold used in the manufacturing of the hard disk media or a read/write head assembly part. The cleaning solution comprises a polycarboxylate polymer or an ethoxylated polyamine. The method comprises the step of contacting a surface of the substrate with a cleaning solution comprised of a polycarboxylate polymer or an ethoxylated polyamine. Additional optional steps in the method include applying acoustic energy to the cleaning solution and/or rinsing the surface with a rinsing solution with or without the application of acoustic energy to the rinsing solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.