Epoxy resin for prepreg, prepreg, fiber-reinforced composite material and methods for production thereof
US7959838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2008 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | May 7, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.