Adhesive film for stacking semiconductor chips
US7960023B2 · kind B2 · utility
2Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2007 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Feb 10, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is provided an adhesive film for stacking semiconductor layers of chips comprising: a first adhesive layer comprising phenoxy resin, epoxy resin and phenol resin; a second adhesive layer comprising phenoxy resin and an ultraviolet ray curable compound; and a third adhesive layer comprising phenoxy resin, epoxy resin and phenol resin, wherein the second adhesive layer is disposed between the first adhesive layer and the third adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.