Patent · US Active

Method for the manufacture of electronic devices on substrates and devices related thereto

US7960246B2 · kind B2 · utility

69Cited by

8References

15Claims

0Family size

Assignees

IMEC · BE
UMICORE · BE

Inventors

Giovanni Flamand · Oelegem, BE
Wim Geens · Mechelen, BE
Jef Poortmans · Kessel-Lo, BE

Key dates

Filing date	Jun 6, 2005
Grant date	Jun 14, 2011
Priority date	—
Expiry date	May 26, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldTransport
WIPO sectorMechanical engineering

Abstract

Methods for manufacturing electronic devices and devices produced by those methods are disclosed. One such method includes releasably bonding a first surface of a device substrate to a face of a first carrier substrate using a first bonding agent to produce a first composite substrate, where the face of the first carrier substrate includes a pattern of trenches. The method also includes processing the device substrate to manufacture an electronic device on a second surface of the device substrate. The method further includes releasing the device substrate from the first carrier substrate by a releasing agent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.