Semiconductor package
US7960837B2 · kind B2 · utility
3Cited by
4References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 9, 2008 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Aug 11, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor package, at least two of connection pads are formed into different-shape pads which are different in planar shape from other connection pads, and one different-shape pad and another different-shape pad are disposed in a manner that, when the position of the one different-shape pad is rotated about the center point of the semiconductor package, the position does not coincide with the disposition position of the other different-shape pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.