Packaging structure of SIP and a manufacturing method thereof
US7960847B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 2010 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | May 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.