Patent · US Active

Mechanical decoupling of a probe card assembly to improve thermal response

US7960989B2 · kind B2 · utility

4Cited by
39References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 4, 2009
Grant dateJun 14, 2011
Priority date—
Expiry dateAug 20, 2029

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2889
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the frame by one or more non-adjustably fixed coupling mechanisms. Each of the probe substrates can have probes that are electrically connected through the probe card assembly to an electrical interface on the wiring substrate to a test controller. The non-adjustably fixed coupling mechanisms can be simultaneously stiff in a first direction perpendicular to the major surface and flexible in a second direction generally parallel to the major surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.