Heat dissipation device and power module
US7961474B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 8, 2010 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Jan 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A radiator having a radiator fin sandwiched between and joined to a top plate and a bottom plate is provided on an insulating substrate, which has a semiconductor element arranged on one face side thereof, on the other face side thereof. The radiator fin is a corrugated fin that includes a first region that includes a joint peak portion joined to the bottom plate and has a height in an amplitude direction which is substantially equal to a distance between the top plate and the bottom plate, and a second region that includes a non-joint peak portion separated from the bottom plate by a predetermined gap and has a height in the amplitude direction which is smaller than the distance between the top plate and the bottom plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.