Multi-chip system including capacitively coupled and optical communication
US7961990B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2007 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Jan 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1433
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of a system are described. This system includes an array of chip modules (CMs) and a baseplate, where the baseplate is configured to communicate data signals via optical communication. Moreover, the array includes first CMs mechanically coupled to first alignment features on the baseplate, and adjacent second CMs mechanically coupled to second alignment features on the baseplate. In this array, a given first CM is electrically coupled to a given set of electrical proximity connectors. Additionally, the array includes bridge components, wherein a given bridge component is electrically coupled to the second SCM and another set of electrical proximity connectors, which is electrically coupled to the set of electrical proximity connectors, thereby facilitating communication of other data signals between adjacent first CMs and second CMs via electrical proximity communication. Moreover, the given bridge component is optically coupled to the baseplate, thereby facilitating optical communication of the data signals between CMs via the baseplate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.