Multidimensional process window optimization in semiconductor manufacturing
US7962234B2 · kind B2 · utility
4Cited by
6References
11Claims
0Family size
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Key dates
| Filing date | Jun 9, 2008 |
| Grant date | Jun 14, 2011 |
| Priority date | — |
| Expiry date | Feb 16, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for optimizing multiple process windows in a semiconductor manufacturing process is disclosed. The method comprises performing dependent variable composition on a plurality of dependent variables. Metrology data is joined with the dependent variables, and then a partial least squares regression is performed on the joined data set to obtain a prediction equation, and a variable importance prediction for each process window in a process window set. A set of product limited yield are derived, and the process window, set is adjusted, and the yields recalculated, until an optimal process window set is derived.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.