Micromechanical component and method for fabricating a micromechanical component

US7964428B2 · kind B2 · utility

Assignee

• LITEF GmbH · DE

Inventors

• Uwe Breng · Gundelfingen, DE
• Wolfram Geiger · Gomaringen, DE

Key dates

• Filing date: Apr 3, 2006
• Grant date: Jun 21, 2011
• Expiry date: Dec 29, 2027

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1461
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for fabricating a microelectromechanical or microoptoelectromechanical component. The method includes producing first and second layer composites. The first has a first substrate and a first insulation layer, which covers at least one part of the surface of the first substrate, while the second has a second substrate and a second insulation layer, which covers at least one part of the surface of the second substrate. An at least partly conductive structure layer is applied to the first insulation layers and the second composite is applied to the structure layer so that the second insulation layer adjoins the structure layer. The first and second layer composites and the structure layer are configured so that at least one part of the structure layer that comprises the active area of the microelectromechanical or microoptoelectromechanical component is hermetically tightly sealed by the first and second layer composites. Contact holes are formed for making contact with conductive regions of the structure layer within the first and/or second substrate.