Interposer for decoupling integrated circuits on a circuit board
US7964802B2 · kind B2 · utility
3Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2005 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Nov 26, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interposer (20) is used for decoupling a microchip (10) on a circuit board (30). The interposer (20) contains on its upper and lower surfaces structured metal layers (26a-26d) for attachment to the microchip (10) and the circuit board (30), respectively. Inside the interposer, there are two sets of mutually isolated metal structures (21, 22) extending substantially perpendicular to the upper and lower surfaces of said interposer (20). The first set (21) extends closer towards the upper surface than the second set (22), while said second set (22) extends closer towards the lower surface than said first set (21).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.