High gain read circuit for 3D integrated pixel

US7965329B2 · kind B2 · utility

Assignee

• OmniVision Technologies, Inc. · US

Inventors

• John P. McCarten · Penfield, US
• Joseph R. Summa · Hilton, US
• Todd J. Anderson · Fairport, US
• Cristian A. Tivarus · Rochester, US

Key dates

• Filing date: Sep 9, 2008
• Grant date: Jun 21, 2011
• Expiry date: Sep 30, 2029

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/803

Abstract

An image sensor includes (a) a first wafer having (i) a photosensitive area; (ii) a charge-to-voltage conversion region; (b) a second wafer having (i) a first amplifier that receives a signal from the charge-to-voltage conversion region; (c) an electrical interconnect connecting the charge-to-voltage conversion region to an input of the amplifier; (d) an electrically biased shield at least partially enclosing at least a portion of the electrical interconnect.