System, method and apparatus for using overmolded dampeners to absorb shock and vibration
US7965500B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2008 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Feb 11, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/1656
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A computer chassis has overmolded dampeners for absorbing shock and vibration. Electronic components are hard mounted to points inside the computer chassis. Overmolded dampeners are affixed to corners, surfaces and sides of the laptop such that shock and vibration are absorbed by the dampeners before the shock or vibration can damage the electronic components. Affixing dampeners to portions of the chassis may provide shock and vibration protection with minimal weight.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.