Heat sink apparatus and method for allowing air to flow directly to an integrated circuit package thereunder
US7965506B1 · kind B1 · utility
0Cited by
9References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2007 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Dec 11, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink apparatus and method are provided for allowing air to flow directly to an integrated circuit package thereunder. In use, a heat sink is provided including an upper portion with a plurality of fins, and a lower portion configured for allowing air to flow directly to an integrated circuit package thereunder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.