Assemblies and methods for dissipating heat from handheld electronic devices
US7965514B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2009 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Aug 9, 2029 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/203
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
According to various aspects of the present disclosure, exemplary embodiments include assemblies and methods for dissipating heat from an electronic device by a thermally-conducting heat path to the external casing via one or more portions of an electromagnetic interference shield and/or thermal interface material disposed around the device's battery or other power source. In an exemplary embodiment, a shield (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the shield. In another exemplary embodiment, a thermal interface material (or portions thereof) may be disposed about or define a battery area such that heat may be transferred to the external casing by a thermally-conductive heat path generally around the battery area through or along the thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.