Characterizing curvatures and stresses in thin-film structures on substrates having spatially non-uniform variations
US7966135B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 6, 2006 |
| Grant date | Jun 21, 2011 |
| Priority date | — |
| Expiry date | Feb 16, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L5/0047
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Techniques and devices are described to use spatially-varying curvature information of a layered structure to determine stresses at each location with non-local contributions from other locations of the structure. For example, a local contribution to stresses at a selected location on a layered structure formed on a substrate is determined from curvature changes at the selected location and a non-local contribution to the stresses at the selected location is also determined from curvature changes at all locations across the layered structure. Next, the local contribution and the non-local contribution are combined to determine the total stresses at the selected location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.