Patent · US Active

Adhesive application apparatus for use with an assembling machine

US7967046B2 · kind B2 · utility

0Cited by

3References

5Claims

0Family size

Assignee

Silverbrook Research Pty Ltd · AU

Inventors

Stephen Richard O'Farrell · Sydney, AU
Jan Waszczuk · Sydney, AU
David Bernardi · Chatswood, AU
Toby Desmond Oste · Chatswood, AU
Mark Janos · Sydney, AU
William Granger · Sydney, AU

Key dates

Filing date	Aug 19, 2008
Grant date	Jun 28, 2011
Priority date	—
Expiry date	Feb 12, 2029

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T156/1798
WIPO fieldOther special machines
WIPO sectorMechanical engineering

Abstract

The invention relates to an adhesive application apparatus for use with an assembling machine for assembling operatively upper and lower components for carrying printhead integrated circuits. The application apparatus includes a plate and a dispensing mechanism which includes an adhesive reservoir, said mechanism being operatively engaged with said plate in a sealing and sliding manner, the mechanism configured to dispense adhesive onto the plate when sliding along the plate. The apparatus also includes a displacement mechanism to slide the dispensing mechanism along the plate, and a control system to control operation of the dispensing and displacement mechanisms.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.