Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof

US7967062B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Levi A. Campbell · Poughkeepsie, US
• Richard C. Chu · Hopewell Junction, US
• Michael J. Ellsworth, Jr. · Poughkeepsie, US
• Keith E. Fogel · Potsdam, US
• Madhusudan K. Iyengar · Woodstock, US
• Roger R. Schmidt · Poughkeepsie, US
• Robert E. Simons · Poughkeepsie, US

Key dates

• Filing date: Jun 16, 2006
• Grant date: Jun 28, 2011
• Expiry date: Oct 12, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/4935
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A composite interface and methods of fabrication are provided for coupling a cooling assembly to an electronic device. The interface includes a plurality of thermally conductive wires formed of a first material having a first thermal conductivity, and a thermal interface material at least partially surrounding the wires. The interface material, which thermally interfaces the cooling assembly to a surface to be cooled of the electronic device, is a second material having a second thermal conductivity, wherein the first thermal conductivity is greater than the second thermal conductivity. At least some wires reside partially over a first region of higher heat flux and extend partially over a second region of lower heat flux, wherein the first and second regions are different regions of the surface to be cooled. These wires function as thermal spreaders facilitating heat transfer from the surface to be cooled to the cooling assembly.