Repair soldering method for repairing a component which comprises a base material with an oriented microstructure

US7967183B2 · kind B2 · utility

Assignees

• Siemens Aktiengesellschaft · DE
• MTU Aero Engines AG · DE

Inventors

• Dirk Goldschmidt · Moers, DE
• Matthias Oechsner · Wetter (Ruhr), DE
• Michael Ott · Wetter (Ruhr), DE
• Uwe Paul · Ratingen, DE
• Ursula Pickert · Wetter (Ruhr), DE
• Eckart Schumann · Wetter (Ruhr), DE
• Beate Seiler · Affaltrach, DE
• Robert Singer · Erlangen, DE
• Jan Steinbach · Berlin, DE
• Andreas Volek · Herzogenaurach, DE
• Volker Vosberg · Wetter (Ruhr), DE

Key dates

• Filing date: Jan 28, 2005
• Grant date: Jun 28, 2011
• Expiry date: Jan 22, 2027

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23K2101/001
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The invention relates to a method for repairing components comprising a base material with an oriented microstructure, wherein the repair point comprises a correspondingly oriented microstructure as the surrounding base material. According to the inventive method, solder is applied in the region of a point which is to be repaired and is soldered to the component by means of a heating effect produced by a device. A temperature gradient, i.e., approximately a temperature characteristic, is produced during the heating effect, said temperature characteristic ranging from a high to a low temperature in the region of the point which is to be repaired.