Method for electroplating a substrate
US7968010B2 · kind B2 · utility
2Cited by
165References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2010 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Feb 10, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
One or more embodiments provide for a device that utilizes voltage switchable dielectric material having semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material on the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.