Lead-free tin alloy electroplating compositions and methods
US7968444B2 · kind B2 · utility
10Cited by
13References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2009 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Dec 31, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, a flavone compound and a dihydroxy bis-sulfide. The electrolyte compositions are free of lead and cyanide. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.