Microdissection apparatus and method
US7968819B2 · kind B2 · utility
1Cited by
14References
36Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 28, 2003 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Jul 13, 2026 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/066
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A microdissection apparatus includes a laser light source to emit laser light, and a laser light irradiation optical system to irradiate a sample with the laser light from the laser light source. The laser light irradiation optical system includes an active optical element, which is allowed to form a pattern reflecting a necessary area, and sets a laser light irradiation area, to which the laser light is applied, based on the pattern formed on the active optical element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.