Support member for mounting a semiconductor device, conductive materials, and its manufacturing method
US7968980B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 1, 2007 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Apr 8, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
A semiconductor device comprises a support member having a pair of first conductive materials and a pair of second conductive materials on an insulating substrate, and a sealing member covering a semiconductor element arranged on the support member, wherein the support member has an insulating portion where the insulating substrate is exposed between the pair of the first conductive materials, and at least one of the pair of the second conductive materials is arranged along the side of the insulating portion, and the sealing member is disposed so that the sealing member is over at least a part of at least one of the first conductive materials and the second conductive materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.