Heat transfer system, method, and computer program product for use with multiple circuit board environments
US7969733B1 · kind B1 · utility
5Cited by
15References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2008 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Dec 17, 2028 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.