System for cooling memory modules
US7969736B1 · kind B1 · utility
51Cited by
10References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2010 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Feb 8, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
DIMMs are cooled by positioning a thermally conductive base between adjacent DIMMs. The thermally conductive base, such as a heat pipe or metal rod, receives heat from the DIMMs through thermally conductive elements that are selectively biased outward against the installed DIMMs. The base transfers the heat to a liquid conduit extending along the end of the DIMMs, where a circulating liquid carries away the heat. The thermally conductive elements provide an adjustable span to accommodate variations in distance between the DIMM surfaces. Embodiments of the invention may be installed without extending above the height of the DIMM.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.