Heat dissipation apparatus
US7969737B2 · kind B2 · utility
1Cited by
6References
12Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 27, 2009 |
| Grant date | Jun 28, 2011 |
| Priority date | — |
| Expiry date | Jan 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus includes a heat absorbing base, a heat conductive core, two fin assemblies and two heat pipes. The heat conductive core is attached to the heat absorbing base, and includes an elliptical, cylindrical body having an elliptical, cylindrical side surface. The two fin assemblies are located at two opposite sides of a major axis of the heat conductive core, respectively, and attached to the side surface of the heat conductive core. The two heat pipes connect the two fin assemblies with the heat absorbing base, respectively, transferring heat from the heat absorbing base to the fin assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.