Method and apparatus for making a radio frequency inlay
US7971339B2 · kind B2 · utility
18Cited by
66References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 24, 2007 |
| Grant date | Jul 5, 2011 |
| Priority date | — |
| Expiry date | Dec 9, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus are provided for making radio frequency (RF) inlays. The RF inlays include an integrated circuit and an antenna affixed to a substrate material carrying the integrated circuit. During processing, portions of the wire forming the antenna are located adjacent to, but not directly over the integrated circuit. In the subsequent processing step, the wire ends are placed in contact with and secured to the integrated circuit terminal areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.