Anti-tarnish coatings
US7972655B2 · kind B2 · utility
17Cited by
73References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 21, 2007 |
| Grant date | Jul 5, 2011 |
| Priority date | — |
| Expiry date | Feb 17, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/124
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.