Resin composition and film
US7972680B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2007 |
| Grant date | Jul 5, 2011 |
| Priority date | — |
| Expiry date | Jan 30, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/254
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
To realize a resin composition which enables formation of a film having excellent film formability and bending resistance and having a small retardation. A resin composition of the present invention comprises: an acrylic resin as a main component; and organic fine particles whose average particle diameter ranges from 0.01 μm to 1 μm, wherein a glass transition temperature of the acrylic resin ranges from 110° C. to 200° C., and each of the organic fine particles has a structural unit of a vinyl cyanide monomer and a structural unit of an aromatic vinyl monomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.