Interface techniques for coupling a microchannel plate to a readout circuit
US7973272B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2009 |
| Grant date | Jul 5, 2011 |
| Priority date | — |
| Expiry date | Dec 14, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/803
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Techniques are disclosed that can be used to interface a microchannel plate (MCP) with readout circuitry. The techniques can be employed, for instance, with MCP based devices used in a numerous sensing/detection applications, and are particularly suitable for applications where it is desirable to interface an MCP having a relatively large active area to a readout circuit having a relatively smaller active area. The interface effectively decouples anode geometry from ROIC geometry and may also be configured with flexible anode pad geometry, which allows for compensation of optical blur variations as well as a very high fill factor. The interface can be made using standard semiconductor materials and photolithography techniques, and can be configured with thermal expansion qualities that closely track or otherwise match that of the readout circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.