Integrated circuit and method of fabricating the same

US7973417B2 · kind B2 · utility

Assignee

• Qimonda AG · DE

Inventors

• Alfred Martin · Munich, DE
• Barbara Hasler · Munich, DE

Key dates

• Filing date: Apr 18, 2008
• Grant date: Jul 5, 2011
• Expiry date: Sep 16, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An article including a substrate having a blind hole formed therein, wherein the blind hole is defined by a floor and a sidewall and a solder connection is provided. The solder connection may couple a first contact pad to a second contact pad. The first contact pad may cover a first field of the floor of the blind hole, and may also promote wetting of a solder material of the solder connection. Wetting may be impeded on a second field of the floor of the blind hole. The second contact pad may be arranged above a surface of a further substrate, wherein the surface of the further substrate may be oriented perpendicularly to the floor of the blind hole in the substrate.